Electronics&Packaging Vol.22,No.1～12 Contents Index(2022)
2023-01-05 04:40:54
電子與封裝 2022年12期
Author No.(Page)
“SiCPowerSemiconductorTechnology”SpecialReport
Review of SiC MOSFET Gate Drivers（Invited Paper）ZHOU Zekun,CAO Jianwen,ZHANG Zhijian,ZHANG Bo 2（020101）
SiC Device to Challenge Existed Packaging Technologies（Cover Paper/Invited Paper）CAO Jianwu,LUO Ningsheng,DELATTE Pierre,VANZIELEGHEMEtienne,BURBIDGE Rupert 2（020102）
Technical Paths towards SiC Motor Controller for Electric Vehicles（Invited Paper）
NING Puqi,ZHENGDan,KANG Yuhui,CHEN Yongsheng,CUI Jian,ZHANGDong,LI Ye,FAN Tao 3（030101）
Research on Characteristics of 10 kV SiC GTO Device CHENG Lin,LUO Jiamin,GONG Cunhao,ZHANG Yourun,TANG Yi,MEN Fuyuan,DU Xiaoli 3（030102）
Research Progress on Reliability of 4H-SiC Power MOSFET（Invited Paper）BAI Zhiqiang,ZHANG Yuming,TANG Xiaoyan,SHEN Yingzhe,XU Huiyuan 4（040101）
Design and Fabrication of Ultra-High Voltage SiC N-Channel IGBT(Cover Paper)YANG Xiaolei,LI Shiyan,ZHAO Zhifei,LI Yun,HUANG Runhua,BAI Song 4（040102）
Research Progress of Irradiation Induced Defects Experiment of SiC Power Device（Invited Paper）YANG Zhimei,GAO Xu,LI Yun,HUANG Mingmin,MA Yao,GONG Min 5（050101）
Review and Prospect of SiC Device Packaging（Invited Paper）DU Zechen,ZHANG Yijie,ZHANG Wenting,AN Yunlai,TANG Xinling,DU Yujie,YANG Fei,WU Junmin 5（050102）
Progress in the Study of Irradiation Effects of SiC Power Devices（Invited Paper）LIU Chaoming,WANG Yaning,WEI Yidan,WANG Tianqi,QI Chunhua,ZHANG Yanqing,MA Guoliang,LIU Guozhu,WEI Jinghe,HUO Mingxue 6（060101）
Recent Advances in SiC Devices for Railway Traction（Invited Paper）LI Chengzhan,ZHOU Caineng,QIN Guangyuan,SONG Guan,CHEN Ximing 6（060102）
Packaging&Assembly&Testing
Failure Mode of Cu-Sn-Cu Micro-Bumps Based on Different Bonding Parameters ZHANG Xiaorui 1（010201）
Research on Energy Distribution of Energy Storage Welding in Integrated Circuit Package Based on MATLAB WANG Xuguang,YANG Jiayi,JIANG Kai,ZOU Jia 1（010202）
Research on Process of LTCC Highly Precise Substrate for Packaging YUE Shuaiqi,YANG Yu,LIU Gang,ZHOU Yi,WANG Chunfu,WANG Guihua 1（010203）
Welding Defect Analysis and Optimization of QFN Package LIU Ying,WU Ying,CHEN Gaiqing,XU Chunting 1（010204）
Plum-Blossom Dispensing for Bonding Process of Small Package Components JI Meining,CHANG Mingchao 1（010205）
LDO Failure Analysis and Countermeasure HU Min 1（010206）
Analysis of Cracking Mechanism of Microwave Module Bare Chip LI Qing 1（010207）
Thermal Analysis of Plating Structure on Parallel Seam Sealing Process JIANG Han,XU Zhongguo,JIANG Yuqi 2（020201）
Failure Simulation Analysis and Verification of the Package Device Under Multiple Stress Superposition Situation LI Kui,ZHANG Zhixiang,YANG Yujun,LIU Min 2（020202）
Research on the Surface Grinding Process of Direct Plated Copper Ceramic Substrate WANG Zhe,LIU Songpo,LYU Rui,CHEN Hongsheng,CHEN Mingxiang 3（030201）
Design and Implementation of AD Static Parameter Automatic Test System Based on STM32F429 CHEN Hengjiang,ZHONG Haidong,PENG Jiali 3（030202）
USB PD Fast Charging Protocol Chip Probe Test Based on ATE TANG Caibin 3（030203）
On-Line Testing Techniques of 32 bit MCU Chip Based on J750Ex-HD YU Yongtao,WANG Xiaoqiang,YU Junjie,CHNE Yuhai,LUO Jun 3（030204）
Research Status and Development Trend of LTCC Package Technology（Cover Paper/Invited Paper）LI Jianhui,DING Xiaocong 3（030205）
Research on Water and Oxygen Barrier Performance Based on Al2O3/NEA121 Encapsulation Film PENG Rong,YANG Zhenbo,WANG Jun 4（040201）
Heat Transfer Performance Analysis of Three Channel Structures for Flat Micro Heat Pipe LI Xiaofeng,PAN Zhongliang 4（040202）
Effect of Soldering Parameters on Pores and Microstructure of Au80Sn20 Solder Package YAN Yanhong,XU Heng,WANG Yinghua,CHEN Xu,LI Shouwei,LIU Li'en 4（040203）
Research on Low Void Vacuum Vapor Soldering Technology of Printed Circuit Boards Electrical Connectors QIU Jingping,WANG Wenzhi,LI Shaocong,MAO Haike,ZHANG Shaodong 5（050201）
Methods about Test Platform Transfer and Test Pattern Conversion Based on SSD Controller Device FENG Wenxing,YU Shan,ZHOU Meng,LIU Jiong 5（050202）
Research on Thermal Resistance Matrix of 3D Stacked Package（Cover Paper）HUANG Wei,JIANG Han,ZHANG Zhenyue,JIANG Yuqi,ZHU Sixiong,YANG Zhonglei 5（050203）
Research on Process and Performance of Laser Sealing in Electronic Packaging WANG Xiaowei,TANG Zhixu 6（060201）
Design of X-Band Miniature Package GaN Power Amplifier CUI Zhaotan,CHEN Zheng,DU Pengbo,JIAO Xuelong,QU Hanbin 6（060202）
Case Analysis of Increased Contact Resistance of Conductive Adhesives for Multi-Chip Module ZHANG Jian,WANG Daochang,JIN Jiafu,DONG Yu,LI Jing 6（060203）
Study on Long-Term Storage Reliability and Life Prediction of Surface Mounted Tin-Based Solder Joints（Cover Paper）ZHANG He,FENG Jiayun,CONG Sen,WANG Shang,AN Rong,WU Lang,TIAN Yanhong 7（070201）
Single Event Effect Testing Method Based on Billion-Gate UltraScale+Architecture FPGA XIE Wenhu,ZHENG Tianchi,JI Zhenkai,YANG Maolin 7（070202）
Development and Application of Epoxy Molding Compound for Low Warpage BGA Package LI Jin,SHAO Zhifeng,QIU Song,SHEN Wei,PAN Xuqi 7（070203）
High Density Assembly and Packaging Technology Based on Flip-Chip on TSV and Chip Stacking（Cover Paper）TANG Shuli,ZHAO Guoliang,XUE Yahui,YUAN Hai,YANG Yujun 8（080201）
Application of PID Temperature Control Algorithm Based on Bayesian Learning in Chip Oven LIANG Daping,ZHAO Limin,WANG Hongbin 8（080202）
Influence of Power Level Current Path on Power Management Chip Evaluation GU Xiaoming,LI Huan,XU Qinghao 8（080203）
Measurement of Signal Delay Error of Automatic Test Equipment Based on FPGA JI Zhenkai,WU Zhen 8（080204）
Design and Application of System in Package for DSP XING Zhengwei,XU Cong,DING Zhen,CHEN Kangxi 8（080205）
Research Progress of Reliability Improvement of Reflow Soldering in Chip Rework（Invited Paper）LIU Shaohong,TAN Qi 8（080206）
Progress on the Research and Application of Thermally Latent Curing Accelerators in Epoxy Molding Compound（Review）WANG Lu,CHANG Baixue,YUE Yiyu,WU Yulin,WU Hao,CHEN Shujing,LIU Jingang 9（090201）
Research Progress of Low Temperature Welding Technology for Electronic Components（Cover Paper/Review）WANG Jiaxing,YAO Quanbin,LIN Pengrong,HUANG Yingzhuo,FAN Fan,XIE Xiaochen 9（090202）
Discussion of Developing New IC Products on Eutectic Platform HU Min 9（090203）
Debugging of 16 Gbit/s High-Speed SerDes and the Selection Scheme of AC Coupling Capacitor ZHANG Xiujun,YU Zhi,SONG Linfeng,JI Zhenkai 9（090204）
Parametric Modeling Simulation for AlSi Wire Bonding JIANG Yuqi,LIU Shuli,XIA Chenhui,WANG Yiheng,CHEN Qiaohong,ZHOU Chaojie 9（090205）
Influence of Different Specifications of Pigment Carbon Black on Properties of Epoxy Molding Compound CAO Erping,CAI Xiaodong,MOU Haiyan 9（090206）
Research on the Application of Eco-Friendly Bromo-Containing Flame Retardants in Epoxy Molding Compounds（Cover Paper）WANG Lu,CHANG Baixue,YUE Yiyu,WU Yulin,WU Hao,CHEN Shujing,LIU Jin'gang 10（100201）
Effect of Sphericity of Silica Powder on Melt Flow of Epoxy Molding Compounds CHEN Xiaofei 10（100202）
Research on Ultra-Low Loop Gold Wire Ball Bonding Technology in Millimeter-Wave RF Interconnection ZHANG Pingsheng,ZHU Chenjun,WEN Zehai,TANG Quangen 10（100203）
Method for Measurement of Fuse Resistance Value in eFuse YAN Ying,ZHANG Rui 10（100204）
Analysis Method of Cut-off Frequency of Ceramic Transmission Structure YU Ximeng,YANG Zhentao,LIU Linjie 11（110201）
Preparation of High Reliability Epoxy Molding Compound for Third Generation Semiconductor Devices（Cover Paper）WANG Diannian,LI Zeliang,GUO Bendong,DUAN Jiawei 11（110202）
Research on Test Method of FPGA Refresh Control Circuit YAN Huiqiang,HUANG Xiaobin,XIE Wenhu 11（110203）
Theoretical Calculation of Transmission Line Loss in Package Design ZHOU Liyan,TANG Wenxue,PANG Yingying,WANG Jianfeng,WANG Bo 11（110204）
Review of MEMS Wafer-Level Packaging Based on Wafer Bonding Techniques LIANG Hengmao 12（120201）
Failure Analysis and Improvement of Passivation Layer Damage of Thin Plastic Packaging Chip ZHANG Bo,LI Gongjin,QIN Pei 12（120202）
Effect of Si Content on the Properties of Si-Al Alloy Electronic Packaging Materials LI Haijun,ZONG Fuchun,HU Zengwu,LI Yunfei,PENG Wenjia,QI Jing 12（120203）
Cause and Control of External Dead Pixel of Capacitive Sensor Chip LI Gongjin,ZHANG Bo,QIN Pei 12（120204）
Circuit&System
Design of Data Transmission Board Based on MicroTCA DING Taojie,HE Jinchi,ZHENG Lihua,ZHU Baiyang,WANG Jinxiang 1（010301）
Design of Multi-Chip DDR3 High-Speed Dynamic Memory Based on SiP Technology ZHANG Xiaodie,QIU Yingxia,XU Cong,XING Zhengwei 1（010302）
High Reliability Read-Write Separation 14T Storage Cell Design ZHANG Jingbo,ZHU Ya’nan,PENG Chunyu,ZHAO Qiang 1（010303）
Compensation Method for Color Cast of Fine Pixel Pitch LED Display FENG Yi,XING Xiangming,ZHOU Yang 1（010304）
Design and Implementation for SRAMController Based on Small-Pitch LED Driver IC FAN Xueshi,WANG Song,TANG Maojie,LI Mingxiao 1（010305）
Frequency Doubling OS-PWMAlgorithm for LED Driver IC WANG Zhenyu,WANG Xueyuan,TANG Maojie,FAN Xueshi 1（010306）
Progress of Research and Application of Object Detection Based on Deep Learning(Cover Paper)LYU Lu,CHENG Hu,ZHU Hongtai,DAI Nianshu 1（010307）
Design of Online Debugging Software Based on FPGA LI Qing,DONG Zhidan,HUI Feng 2（020301）
Design of L-Band 1200 WSolid State Power Amplifier MENG Qingxian,XI Hongzhu,FANG Hang,WANG Liang,WANG Lin,YE Xin,ZHAN Rui 2（020302）
Fast-Transient LDO Circuit for GaN HEMT Gate Driving Circuit CHEN Hengjiang,ZHOU Dejin,HE Ningye,WANG Li,CHEN Zhenhai 2（020303）
Architecture and Behavioral Model Design of 18 bit 20 MS/s Pipeline ADC YANG Ying,LI Fei,LIU Yingyi,TANG Xusheng,MIAO Peng 2（020304）
Current and Emerging Trends of Task Mapping in Many-Core Systems（Invited Paper）WU Qian,WANG Xiaohang 2（020305）
IP Design of Anti-Radiation LVDS Driving Circuit MA Yike,WANG Yiyao,YAO Jin,HUA Zhengyong,YIN Ya'nan,ZHOU Xinjie,YAN Yuankai 2（020306）
Design of a Novel Millimeter-Wave Differential Lines-Substrate Integrated Waveguide Transition CHEN Huiyong,WANG Xiaopeng,SUN Zeyue,WANG Jian,CHEN Lin,YAO Wusheng 2（020307）
UVM-Based Verification Platform for PCI Express Bus Controller ZHAO Sai,YAN Hua,CONG Hongyan,ZHANG Yanfei 2（020308）
Design and Integrity Analysis of ADC Power Supply NI Xiaodong,ZHAO Jiaan,XIAO Yongping,MA Shijuan 2（020309）
Design and Implementation of the Anti-Irradiation Control System Based on DSP WU Song,GU Lin,SUN Xiaodong,SONG Chenyang 3（030301）
Performance Analysis and Optimized Design of Boundary Scan Register SUN Cheng,SHAO Jian 3（030302）
Zero-Crossing Detection Technology in LED Driver ZHU Xiaojie,WANG Dong 3（030303）
The Effectuation of Semantic Segmentation ENET Model Based on Vitis-AI HU Kai,LIU Tong,WU Yaheng,XIE Da 3（030304）
A Level Conversion Unit with Low Power Consumption,High Speed and Wide Level Range HU Qingcheng,WU Jiandong,WAN Luxu 3（030305）
A New Design of High Precision Low Power Relaxation Oscillator CHEN Tianhao,LI Fuhua,MA Zhiyin 3（030306）
Design of Class AB Buffer Based on Differential Flipped Voltage Follower MA Zhiyin,LI Fuhua,CHEN Tianhao 4（040301）
Method of Automatically Generating Test Cases for Evaluating the Comprehensive Effect of FPGA Synthesis LIU Pei,HUI Feng 4（040302）
Low-Voltage Output Driver with Constant Slew Rate over PVT and Output Load Capacitance Variations GU Ming,CHANG Hong,HUANG Shaoqing,CHEN Haitao 4（040303）
Design of Multi-Channel Servo Valve Drive System ZHANG Pingping 4（040304）
Research on Multiplying Digital-to-Analog Converter for High Precision Analog-To-Digital Converter SHAO Jie,TANG Lu 4（040305）
Research on Flash FPGA Configure Method
PANG Lipeng,LIN Xuhui,MA Jinlong,CAO Liang,SHEN Dandan,WANG Xiaoling,ZHAO Guilin 5（050301）
Electroencephalogram Signal Sensing Chip System Review（Invited Paper）WANG Zibin,LIU Guozhu,SUN Jianhui 5（050302）
Implementation of FPGA Multi-Configuration Method Based on CPLD HAN Liujun,YAO Yao,HAO Guofeng,ZHAO Can 5（050303）
A Dynamic Error Correction Mechanism Based on Extended Hamming Code CHEN Tianpei,WU Xiaosheng,QIANG Xiaoyan 5（050304）
A Differential Reference Circuit Applied in High Precision Pipelined ADC CHI Zhehan,LI Fei,LIU Yingyi,TANG Xusheng,MIAO Peng 5（050305）
Research and Implementation of an SSD Design and Test Method SHEN Qing,ZHANG Meijuan,HOU Qingqing,ZHANG Lei 6（060301）
Design of Virtual Auditory System Based on FPGA CHEN Xin,GAO Bo,GONG Min 6（060302）
A High-Side Driver Circuit with Low Electromagnetic Interference ZHAO Jiehui,LIU Xinghui,RUAN Hao,HUO Jianlong,ZHANG Zhidong,ZHAO Hongliang 6（060303）
Research on the Reset System of Localized Board Loaded with Operating System NING Dongping,ZHANG Zhiqiang,HUANG Ci 6（060304）
Design of a Large-Swing Charge Transfer Circuit for Charge-Domain Analog-to-Digital Converter PANG Lipeng,PAN Fuyue,SU Xiaobo 6（060305）
Design of Ultra-Low Power Reset Circuit SHI Liangjun,YUAN Minmin 7（070301）
Optimal Design of Physically Unclonable Function Characteristics of on-Chip SRAM GAO Guoping,ZHAO Weilin 7（070302）
High-Precision Reference Source Based on Resistor Network Trimming XU Quan,ZHAO Xin,GONG Min,GAO Bo,WILLIS Maureen 7（070303）
Design and Implementation of a Deep Submicron Irradiation Resistant Chip ZOU Wenying,GAO Li,XIE Yumeng,ZHOU Xinjie,GUO Gang 7（070304）
Design and Implementation of an Ultra-Wide Band Frequency Synthesizer Circuit ZHAO Jianxin,LIAO Chunlian 7（070305）
System Level and Reusable Verification Platform for MIPI DSI Based on UVM ZHOU Wenqiang 8（080301）
Design of Technology Mapping Method Based on Decomposition for Multiplexers XIE Shangluan,HUI Feng,LIU Pei,WANG Chenyang,ZHANG Li 8（080302）
Static Error Analysis and Modeling of Current Steering Digital-to-Analog Converter DAI Xingming,LIU Yingyi,TANG Xusheng 8（080303）
FPGA Routing Method Based on Initial Solution Optimization HUI Feng,XIE Shangluan 8（080304）
Temperature Sensor Based on Bipolar Junction Transistor YANG Jiali,ZHAO Xin,GAO Bo,ZHANG Xi,GONG Min 9（090301）
Design of Programming and Readout Circuit for Configuration Chip Based on Anti-Fuse Process CAO Zhengzhou,LI Guangming 9（090302）
System Modeling and Simulation of Current-Mode BUCK DC-DC Converter WANG Cong,LIU Yingyi,TANG Xusheng 9（090303）
Efficient Testability Design for FPGA CHEN Boyin,HU Xiaochen,ZHANG Zhi,ZHAO Sai 9（090304）
Accelerated Function Verification Method for Flash Series FPGA Chips HU Kai,CONG Hongyan,YAN Hua,ZHANG Yanfei,LI Yong 9（090305）
Firmware Upgrade Design for FPGA Distributed System ZHOU Yunsong,HUANG Weixiong,LIU Xiaozhi,FAN Jinwen 10（100301）
Foreground Digital Calibration Algorithm for 14 bit Successive Approximation ADC ZHAO Yuechao,ZHANG Lizhen,LIU Haitao 10（100302）
Design of Suppressing Reverse Leakage of CMOS Output Port YE Zongxiang,SHI Liangjun 10（100303）
Design of on-Chip Power Generation Circuit for Networking Processing Chip YAN Zhenlin,WEN Zhiquan,ZHANG Bing,JIN Xinbo,SHI Shunda 10（100304）
Design of Calibration Circuit Using Feedback Clock Detection for Phase Locked Loop ZHANG Liyi,ZHANG Qinfeng,YU Yang,ZHUO Lin 10（100305）
High Speed MOSFET Gate Drive Circuit with Bipolar Process QIU Minwei,QU Keke,LI Sicha,GUO Gang 10（100306）
Low Temperature Drift Bandgap Reference Source Design with Curvature Compensation WU Shutong,KONG Yuli,WANG Zujin 10（100307）
Research on 12 GSa/s 12 bit Ultra Wideband Data Acquisition System XU Jiawei,WU Jin,KONG Moufu,ZHOU Lei,JI Eryou 11（110301）
Design and Implementation of Measurement and Control System for Single Event Effect of Radiation Resistant LDO LI Huan,GU Xiaoming,XU Qinghao 11（110302）
Design of a Flash-Based FPGA Configuration Chip with MBIST Function KE Zhiming,DANG Kunyuan,SHAN Baochen,CONG Hongyan 11（110303）
High Speed and High Bandwidth Signal Acquisition System Based on TIADC YU Guoliang,LU Xiao,LI Juqiang,MENG Xiangdong,SUN Xiaodong 11（110304）
Design of a Low Power Multi-Mode Class AB Audio Amplifier XU Kaiying,DING Ning,KONG Xiangyi,HUANG Lichao 11（110305）
Constant Valley Current Control Strategy for Active Clamp Flyback DC-DC Converter GUAN Yue,JI Fei,WANG Weibin 11（110306）
Design and Implementation of 200 WGaN Power Amplifier in Ku-Band SU Peng,GU Liming,TANG Shijun,ZHOU Shutong 11（110307）
Structural Design of an Improved Configurable Logic Block CAI Hongrui,FAN Jicong,XU Yanfeng,CHEN Boyin 11（110308）
Simulation Analysis of PCIE 4.0 Interface Signal Integrity in 10 Gigabit Network Card Design LI Kaijie,LIN Fanmiao,YU Wenjun,ZHANG Heng 12（120301）
Design of 17-21 GHz 6 bit High Precision Digital Phase Shifter JIANG Le,WANG Kun,ZHOU Hongjian,ZHOU Ruitao,LI Guangchao 12（120302）
13-bit High Spurious-Free Dynamic Range SAR ADC YANG Zhixin,WILLIS Maureen,GAO Bo,GONG Min 12（120303）
Design of Wireless Communication Encryption System Based on ZigBee YUE Qingqing,PAN Xiaoyang,MENG Xiangdong 12（120304）
High-Performance S-Band 6-bit Digital Phase Shifter ZHANG Fei,CAO Zhihui,YE Kun,YU Tianxin,TANG Zhengbo 12（120305）
Ultra-Low Leakage Current Analog Switch Based on Leakage Current Compensation Technology TANG Yushang,WANG Yao,LIU Jun,LI Ping 12（120306）
Design of a Small-Size Charge-Sensitive Preamplifier for Si-PIN Detector ZHANG Lingling,HE Zixing,GUO Fengli 12（120307）
Receiver Circuit Design Based on JESD204B Protocol KONG Yuli,CHEN Tingting,WAN Shuqin,SHAO Jie 12（120308）
Materials&Devices&Processes
Radiation Hardened Design Based on 0.18μm CMOS Reinforcement Process YAO Jin,ZHOU Xiaobin,ZUO Lingling,ZHOU Xinjie 1（010401）
Schottky Diode High Temperature Reverse Bias Failure Analysis and Improvement HU Min,PENG Junrui 3（030401）
Research on Temperature Uniformity Based on Graphite Susceptor for Silicon Epitaxial Wafer FENG Yongping,HE Wenjun,REN Kai 4（040401）
Failure Analysis on Gain Decrease of a Limiter Low Noise Amplifier JIA Yuwei,WEI Zhiyu,JI Naiyi 4（040402）
Design of FPGA Multi-Program Dynamic Burn-in System JI Zhenkai,XIE Wenhu 4（040403）
P-Band Push-Pull Power Amplifier Using Lumped Elements WANG Qi,TANG Houlu,HE Jin,SUN Yuancheng 4（040404）
Threshold Voltage Degradation Mechanism of p-GaN HEMT Devices Under Repetitive Short Circuit Stress WU Zhen,ZHOU Qi,PAN Chaowu,YANG Ning,ZHANG Bo 6（060401）
Influences of60Coγ-rays on DC Characteristics of Enhancement GaN HEMT QIU Yiwu,WU Weilin,YAN Yuankai,ZHOU Xinjie,HUANG Wei 7（070401）
Study on Generation Mechanism and Control Method of Time-Dependent Haze on 200 mm Silicon Epitaxial Wafer LIU Yong,QIU Guangyin,DENG Xuehua,YANG Fan,JIN Long 7（070402）
Study of Internal Stress in Variable High Stress SiN Films SUN Jianjie,ZHANG Keke,CHEN Quansheng 7（070403）
Simulation Research on the Single Event Transient in Nano-Devices YIN Yanan,WANG Yunzhen,QIU Yiwu,ZHOU Xinjie,GUO Gang 7（070404）
Influences of Irradiation Source on Total Ionizing Dose Characteristics of LVMOS Devices TAO Wei,LIU Guozhu,SONG Side,WEI Yidan,ZHAO Wei 7（070405）
Threshold Shift Mechanism of P-GaN HEMT Under Self-Heating Effect KUANG Weizhe,ZHOU Qi,CHEN Jiarui,YANG Kai,ZHANG Bo 8（080401）
Research on Heavy-Ion Radiation Failure of Trench VDMOS LIAO Congxiang,XU Haiming 8（080402）
ESD Structure Design Based on Thin Epitaxy LI Xiaorong,WU Jiandong,GAO Guoping 8（080403）
Novel Superjunction Reverse Conducting IGBT Without Voltage Snapback Phenomenon WU Yi,XIA Yun,LIU Chao,CHEN Wanjun 9（090401）
Analysis of Influencing Factors of Amplitude-Phase Characteristics for Microwave Modules XIAO Hui,TUO Yingying,LYU Yingfei,LUO Jianqiang 9（090402）
Study on a Thin Layer SOI LIGBT Device with Partial Superjunction ZHOU Miao,TANG Liang,HE Yitao,CHEN Chen,ZHOU Xin 9（090403）
Implementation Methods and Research Progress of Enhanced GaN HEMT Devices（Invited Paper）MU Changgen,DANG Rui,YUAN Peng,CHEN Dazheng 10（100401）
Study on Propagation Losses of SOI-Based Optical Waveguide LI Yikang,ZHANG Yourun,GE Chaoyang,WANG Yu,ZHANG Bo 10（100402）
Evaluation Method of Withstand Voltage Life of Magnetic Coupling Isolators Based on Accelerated Life Test CAO Yucui,LI Zetian,HU Linjiang,ZHANG Feng 10（100403）
Research on Single Event Transient Effect of 4H-SiC Based FinFET Device LIU Baojun,YANG Xiaokuo,CHEN Minghua 11（110401）
Study on Composition Dielectric Film Passivation Technology of Microwave PIN Diode YANG Qing,LI Ning 12（120401）
Development Status and Prospects of High-Temperature SOI Technology(Invited Paper)LUO Ningsheng,CAO Jianwu 12（120402）
Products&Applications
Design of Intelligent Electric Toothbrush Based on Micro-Controller CKS32F030 LU Chaobo,SHEN Wei,WANG Ruiqi,ZHAO Zhihao 1（010501）
Research on License Plate Location System Based on FPGA XIE Jie,CHEN Zheng,FU Jianjun 1（010502）
Probe Chip Design for Network Measurement Based on SiP Technology MAO Zhen,ZHANG Chunping,PAN Fuyue,GU Lin 4（040501）
Military IC Test Serial Number Reading Device Based on Machine Vision Technology TANG Zhen,DAI Ying,ZOU Qiaoyun,CHEN Guangyao,ZHU Tao 5（050501）
Optimal Control Method of Brushless DC Motor ZHU Xinchen,WU Ning,QI Daocai 5（050502）
RF Agile Transceiver Test System Based on LabVIEW GU Xiaoxue,HAO Guofeng 5（050503）
Design and Implementation of Data Destruction Strategy for Solid State Disk on Board ZHANG Zhiqiang,NING Dongping,HUANG Ci,LIU Xiaozhi,FAN Jinwen 5（050504）
Introduction to Fully Depleted Silicon on Insulator Technology and Its Ecosystem（Cover Paper/Invited Paper）ZHAO Xiaosong,GU Xiang,ZHANG Qingdong,WU Jianwei,HONG Genshen 6（060501）
Development and Prospect of Biosensors Based on Microfluidic Chips（Invited Paper）YANG Xiaojun,ZHANG Mengqi,REN Mengna,LI Yuanyue,YAO Zhao 6（060502）
Fire Alarm System Design for Electric Substations Based on LoRa Wireless Communication ZHAO Zhihao,LU Chaobo,TAO Hongping,SHEN Wei 7（070501）
Improved YOLO-V3 Model for Dual-Powered Trolley Bus Based on FPGA DONG Yiping,XIE Da,NIU Zhen,PENG Huwan,JIA Shangjie 8（080501）
Design of Gear Angle and Speed Measurement Based on Hardware Angle Generator SHANG Guoqing,TAO Qingping,LIU Manli 11（110501）
Alarm System Design Based on Sound Acquisition and Classification Technology XU Jie,SHEN Dandan,PAN Shuo,ZHU Xisong 11（110502）
PackagingFrontiersReport
Ni-MWCNTs Efectively Suppress Atomic Diffusion in the Solder Layers of Flip-Chip LED Package ZHAI Xinmeng,ZOU Jun 1（010601）
Thermal Conductivities for Thin Film Materials in CMOS MEMS SONG Xiangyu,XU Wei 2（020601）
A Semiconductor Packaging Material with Soft,High Thermal Conductive and Stable Connection Interface LIU Peng,YANG Cheng 3（030601）
Organic Active Fan-out Packaging Technology GUO Xiaojun,OUYANG Bang,DENG Li'ang,LI Siying,CHEN Sujie 4（040601）
SiC Nanowires Effectively Inhibit the Growth of IMC Layer at the Interface of Solder Joints in Electronic Packaging ZHANG Liang 5（050601）
Size Effect of Sintered Nano-Silver as Packaging Material for High Power Chip GONG He,YAO Yao 6（060601）
A SiC Power Module Package and Reliability Optimization Design Based on Substrate Embedded Technology FAN Jiajie,HOU Fengze 7（070601）
High-Temperature and High-Mechanical Properties of Cu-Cu Joints Using Citrate-Coated Nanosized Ag Paste in Air ZHU Pengyu,ZHANG Shuye 8（080601）
Experimental and Theoretical Study of Creep Behavior of Sintered Micron Silver Nanoindentation GONG He,CHEN Xiangchen,YAO Yao 9（090601）
Wideband Dual-Polarized Millimeter Wave Endfire Antenna Array for 5G Terminals LI Hao,LI Yue 10（100601）
Enhancement of the Fracture Toughness of Sintered Silver by Ni Coated Carbon Nanotubes DAI Yanwei,ZAN Zhi,QIN Fei 11（110601）
Strain Rate Shift for Constitutive Behaviour of Sintered Silver Nanoparticles under Nanoindentation LI Jiao,SHEN Ziyi,LONG Xu 12（120601）
