《電子與封裝》2016年第16卷1～12期目次索引

《電子與封裝》2016年第16卷1～12期目次索引

作者 期(頁)

封裝、組裝與測試

拉鉤位置對引線拉力試驗鍵合強度測試值影響分析 凌 勇，呂 音 一(1)

引線框架塑料封裝集成電路分層及改善 周朝峰，周金成，李習(xí)周 一(5)

DFT類IC的多SITE高效測試研究 孫愷凡 一(9)

基于ATE的可編程邏輯器件測試方法 解維坤 一(12)

基于X射線成像的PBGA器件焊接質(zhì)量檢測 何志剛，梁 堃，周慶波，龔國虎，王曉敏 二(1)

疊層芯片引線鍵合技術(shù)在陶瓷封裝中的應(yīng)用 廖小平，高 亮 二(5)

TO型陶瓷外殼封接失效模式有限元分析 司建文，郭懷新，王子良 二(9)

基于SSIP4L封裝的磁傳感器工藝研究 陳國嵐，牛社強，何文海 二(14)

SiC混合功率模塊封裝工藝 徐文輝，陳云，王立 三(1)

多次回流對不同成分Sn-Pb凸點IMC生長的影響 文惠東，林鵬榮，練濱浩，王 勇，姚全斌 三(4)

可伐與鋁碳化硅復(fù)合材料氣密低溫釬焊工藝研究 金家富，楊 程，霍紹新 三(9)

MCM封裝技術(shù)新進展 胡燕妮 三(12)

NOR型FLASH存儲器測試技術(shù) 王征宇，趙樺 三(15)

一種新型芯片粘接用導(dǎo)電銀膠的性能研究 鄒嘉佳，高 宏，周金文 四(1)

系統(tǒng)級封裝中焊點失效分析技術(shù) 潘書山，陳穎，季斌 四(4)

基于測試系統(tǒng)控制示波器實現(xiàn)模擬信號測試方法 杜元勛 四(9)

宇航元器件在軌測試研究 陳嘉鵬，蔡潔明，黃旭東，宋國棟 四(13)

基于V93000ATE的MTL生成功能碼的方法 趙 樺，王征宇，李 鍇 四(18)

先進射頻封裝技術(shù)發(fā)展面臨的挑戰(zhàn) 夏雨楠，陳宇寧，許麗清，戴 洲，李華新，程 凱 五(1)

RBFN優(yōu)化算法在鍵合機標(biāo)定中的應(yīng)用 洪 喜，李 維，盧 佳，白 虹，孫海波 五(7)

LTCC多層基板腔體工藝研究 李姍澤，劉紅雨，杜 彬，馮曉曦，馬其琪 五(10)

一種混合工藝型微波密封腔體的研制 王 辰，陳 侃，鄭冬俠 五(14)

基于文獻統(tǒng)計方法的多芯片模塊技術(shù)評價研究 呂旭波，黃姣英，高 成，王香芬 五(18)

粘片膠固化對塑封集成電路可靠性的影響 李強，李紅 五(25)

Sn-Cu-Ni系無鉛釬料的研究現(xiàn)狀 陳哲，李陽 六(1)

TO型封裝的真空儲能焊密封工藝研究 黎小剛，許健 六(10)

SiP封裝傳感器中金絲可靠性設(shè)計與分析 劉建軍，郭育華 六(14)

納米級無機粒子對環(huán)氧樹脂膠黏劑擊穿電壓的影響 莫洪強，秦會斌，毛祥根 六(17)

功率MOSFET器件柵電荷測試與分析 張文濤，皓月蘭 六(21)

基于UltraFlex的多時鐘域電路測試方法 嚴(yán)華鑫 六(24)

多芯片陶瓷封裝的結(jié)—殼熱阻分析方法 高 輝，仝良玉，蔣長順 七(1)

LTCC生瓷層壓中腔體的形變評價及控制 王運龍，劉建軍，柳龍華，邱穎霞，王志勤 七(5)

納米無機粒子對環(huán)氧樹脂膠黏劑導(dǎo)熱性能的影響 莫洪強，秦會斌，毛祥根 七(10)

光電器件用金屬外殼高頻性能的改進 袁中朝，許 健，崔大健，姚科明 七(14)

電子封裝用硅鋁合金激光氣密焊接研究 徐 驍，劉 艷，陳潔民，程 凱 八(1)

破壞性試驗?zāi)芰︱炞C方法研究 楊城，譚晨，王伯淳 八(5)

接觸孔關(guān)鍵尺寸測量研究與工序能力提高 李幸和 八(9)

基于場協(xié)同理論的電子元件散熱CFD數(shù)值模擬 馬芳芳，云和明，李永真 九(1)

基于SiP技術(shù)的空間飛行器綜合電子系統(tǒng) 黃 虎，李 華，孔 勇，范國臣，張耀磊 九(6)

一種鋰電池充電電路的測試方法張鵬輝 九(10)

互聯(lián)印制板技術(shù)發(fā)展概況 鄒嘉佳，趙丹，程明生 十(1)

CCGA用焊柱發(fā)展現(xiàn)狀及面臨的挑戰(zhàn) 李守委，毛沖沖，嚴(yán)丹丹 十(6)

LTCC不銹鋼網(wǎng)版清洗工藝優(yōu)化 盧會湘，陳 磊，唐小平，嚴(yán)英占 十(11)

集成電路測試移機評價方法 何燕青 十(15)

準(zhǔn)氣密空腔型外殼的封裝技術(shù) 高 輝，肖漢武，李宗亞 十一(1)

低噪聲放大器的自動測試開發(fā) 張凱虹，蘇 揚，武乾文 十一(7)

集成電路中MOS管導(dǎo)通電阻測量方法 韓新峰，顧衛(wèi)民 十一(10)

基于ATE的電源芯片Multi-Site測試設(shè)計與實現(xiàn) 唐彩彬 十一(14)

微組裝金絲鍵合工序統(tǒng)計過程控制技術(shù) 范少群，趙丹 十二(1)

粘接促進劑對環(huán)氧模塑料粘結(jié)力和分層的影響 秦旺洋，張高文，丁全青 十二(6)

光窗的銦錫合金真空焊接工藝研究 王彬彬，江德鳳 十二(12)

一種光信號處理芯片測試技術(shù)研究 張鵬輝 十二(16)

視覺系統(tǒng)在檢測對稱器件倒反入載帶中的應(yīng)用 唐明津，張 君 十二(20)

一種利用迭代法實現(xiàn)的熔絲修調(diào)方案 吳熙文，顧衛(wèi)民 十二(23)

電路設(shè)計

McBSP與SPI通信的時序與波特率配置分析 孫 敬，陶建中，陳振嬌 一(16)

同步整流BOOST型DC/DC軟啟動電路 李 良，來鵬飛，曹發(fā)兵，陳 峰 一(21)

系統(tǒng)級芯片跨時鐘域同步技術(shù)研究 汪 健，張 磊，王 鎮(zhèn)，趙忠惠，陳亞寧 一(25)

一種基于TYPE-Ⅱ跟蹤型RDC算法的電路設(shè)計 劉太廣，包生輝，苗 韻，強小燕 一(31)

數(shù)字信號處理微系統(tǒng)設(shè)計 楊芳，王良江 二(19)

一種用于以太網(wǎng)收發(fā)器的基帶漂移消除器的設(shè)計張 帥，許圣全，于建旺，李正昊，邱益波，鄭 燕 二(23)

Buck型DC-DC電路振鈴現(xiàn)象的抑制 來鵬飛，陳 峰，曹發(fā)兵，李 良 二(28)

Ku波段收發(fā)組件設(shè)計分析 姚若妍，魏斌 二(33)

FPGA配置SRAM設(shè)計技術(shù) 張艷飛，耿楊 三(20)

基于CMOS工藝的ARINC 429總線接收器設(shè)計 李珂，顧飛 三(23)

基于DICE結(jié)構(gòu)的SRAM抗輻照加固設(shè)計 沈婧，薛海衛(wèi) 三(26)

一種多通道緩沖串口的設(shè)計與實現(xiàn) 楊曉剛，強小燕，劉太廣 三(31)

應(yīng)用于開關(guān)電源芯片的頻率抖動技術(shù) 孫大成 三(37)

一種基于Scanchain的Block RAM的MBIST設(shè)計方法 叢紅艷，閆華，胡凱，張艷飛 四(21)

一種無運放高電源抑制比的帶隙基準(zhǔn)設(shè)計 劉俐 四(24)

一種無線充電管理系統(tǒng)的電路設(shè)計 楊培凱，石雄 四(29)

一種基于比幅比相的單脈沖雷達接收機 支敏，張暉 四(34)

一款高增益、低功耗、寬帶寬全差分運放設(shè)計 周 吉，龔 敏，高 博 五(26)

FPGA芯片時鐘架構(gòu)分析 張艷飛，謝長生，匡晨光 六(28)

一種嵌入式NOR Flash控制器IP的設(shè)計 解同同，李天陽 七(18)

高速SRAM編譯器時序算法 黃奔，彭力，吳海宏 七(22)

一種高速LVDS接收電路的設(shè)計 胡慶城，賀凌煒，周曉彬 七(26)

一種用于OTP存儲器的靈敏放大器設(shè)計 袁同偉，潘 濱，孫杰杰，胡曉琴 七(29)

FIR算法在可重構(gòu)專用處理器中的并行化實現(xiàn) 顧志威，李 麗，傅傳張，傅玉祥，李 偉 八(14)

改進DICE結(jié)構(gòu)的D觸發(fā)器抗SEU設(shè)計 孫 敬，陳振嬌，陶建中，張宇涵 八(19)

一種基于DSP的通用存儲器接口的設(shè)計 解同同，李天陽 八(24)

一種應(yīng)用于DDS 14位1 GS/s電流舵型DAC的設(shè)計 楊俊浩，張甘英，張 濤 八(30)

一種曲率補償?shù)母呔葞痘鶞?zhǔn)源設(shè)計 呂江萍，胡巧云 八(34)

一種CMOS工藝高速端口的ESD保護設(shè)計 孫云華，鄒家軒 九(14)

基于反饋控制的高階溫度補償帶隙基準(zhǔn)電路 王宇星，吳 金 九(18)

一種基于PCI總線的數(shù)字圖形發(fā)生器設(shè)計 蘆 俊，張國良，曹 菁，陳 侖 九(24)

毫米波T/R子陣研究與設(shè)計 張維，張均華 九(28)

基于SKILL語言的參數(shù)化抗輻射器件版圖設(shè)計 胡永強，周 源 九(31)

一種適用于FPGA系統(tǒng)中的變速箱電路設(shè)計 羅 旸，何光旭，雷淑嵐 十(19)

帶看門狗喂狗功能的TMS320F2812遠程加載技術(shù) 蔣炯煒，雷志軍，于 鵬 十(23)

一種低電壓低功耗多諧振蕩器 應(yīng)韜，陳迪平，李經(jīng)珊 十(27)

千萬門級FPGA裝箱及驗證 胡 凱，董志丹，惠 鋒，李 卿，董宜平 十(32)

一種帶有失調(diào)消除電路的帶隙基準(zhǔn)設(shè)計 許圣全，張帥 十一(18)

FPGA中開關(guān)矩陣的研 胡 凱，謝 達，劉 彤，張艷飛，單悅爾 十一(23)

一種用于高度表測量系統(tǒng)的射頻前端收發(fā)組件 蔡 茂，潘 碑，郁 健，馬建軍，溫艷兵 十一(27)

一種用于微波控制電路控制端口的靜電/浪涌電壓泄放結(jié)構(gòu)潘結(jié)斌，陳計學(xué)，姜 楠 十一(31)

移相全橋零電壓PWM軟開關(guān)電路諧振過程研究 王金剛，劉 鵬 十一(35)

寬帶定向耦合器的設(shè)計與應(yīng)用 王家波，曹雪松 十一(39)

一種內(nèi)嵌于DSP2F0X的ECAN設(shè)計及其通訊系統(tǒng)實現(xiàn) 鮑宜鵬，強小燕 十二(26)

一種高精度溫度補償型實時鐘電路 陳富濤 十二(30)

大容量同步雙端口SRAM的仿真方法 周云波，李曉容 十二(35)

微電子制造與可靠性

一種變溫變摻雜流量的埋層外延生長方法 趙建君，肖建農(nóng)，馬林寶 一(34)

激光調(diào)阻L型切割的仿真分析 劉建軍，王運龍 二(37)

HTCC一體化管科失效問題分析 邱穎霞，胡 駿，劉建軍 三(41)

商用0.18 μm CMOS工藝抗總劑量輻射性能研究 寇春梅，謝儒彬，洪根深，吳建偉 四(40)

濺射設(shè)備腔室處理工藝的優(yōu)化研究 王海東 四(45)

一種NiO薄膜的新型制備方法及其應(yīng)用 葉珂，喬明 五(31)

8路寬帶擴展同軸功分器 章勇佳，錢興成，祝慶霖 五(35)

LTCC曲面基板制造技術(shù) 盧會湘，嚴(yán)英占，唐小平，明雪飛 五(39)

LCP基RF MEMS開關(guān)的工藝研究黨元蘭，趙 飛，韓 磊，徐亞新，梁廣華，劉曉蘭，陳 雨，莊治學(xué) 五(43)

CMOS工藝中等離子體損傷WAT方法研究 陳培倉，徐 政，李 俊 六(31)

一種新型CMOS器件長期貯存壽命評價試驗方法 劉士全,徐 超,秦晨飛,王健軍 六(36)

元器件二次篩選過程中的質(zhì)量控制 王小萍 六(39)

L波段大功率開關(guān)的研制 孟向俊，楊磊，黃貞松，宋 艷，許 慶 七(34)

0.18 μm完全隔離型低導(dǎo)通態(tài)電阻(Low Ron)NLDMOS研究 馮喆韻，馬千成，汪 銘 七(39)

NAND Flash浮柵干法蝕刻工藝優(yōu)化解決數(shù)據(jù)寫入失效 陳 亮，周朝鋒，李曉波 七(44)

薄外延CMOS芯片阱摻雜濃度與擊穿電壓的關(guān)系 韓兆芳，謝 達，喬艷敏 八(37)

基于Ge2Sb2Te5存儲介質(zhì)的相變存儲器疲勞特性分析 李 瑩，詹奕鵬，王 蕾 八(41)

用248 nm光刻機制作150 nm GaAs PHEMT器件性能及可靠性評估 郭 嘯，章軍云，林 罡 八(44)

一種改善器件性能的Halo工藝 徐 政，李紅征，趙文彬 九(35)

體硅CMOS集成電路抗輻射加固設(shè)計技術(shù) 米 丹，左玲玲 九(40)

硅的深度反應(yīng)離子刻蝕切割可行性研究 劉學(xué)勤，董安平 九(44)

先進節(jié)點接觸層照明類型優(yōu)化解決光刻制造要求 劉娟 十(36)

T/R組件功放芯片瞬態(tài)溫度響應(yīng)研究 盛 重，周 駿，丁曉明，沈 亞 十(39)

微波晶體管滿功率老煉技術(shù)研究 王小萍，李 雪，張利敏，秦 皓 十(43)

1200 V IGBT的性能優(yōu)化 李宏 十一(44)

二次篩選生產(chǎn)過程中的質(zhì)量控制 王瑜 十二(40)

產(chǎn)品、應(yīng)用與市場

集成電路分選機的維修及應(yīng)用周 淳，蔣文廣 一(38)

基于TMS320DM8168嵌入式圖像處理系統(tǒng)的軟件設(shè)計 王小龍，邵春偉，朱 琛 一(44)

一種高可靠串行通信協(xié)議 桂江華，邵健，潘邈 二(40)

基于微型計算機的高壓交流參數(shù)自動測試系統(tǒng) 陳 洋，謝立利 二(44)

一種新型熱導(dǎo)式氧氣濃度測量方法 錢江蓉，陳 叢，許 磊，胡國俊 三(45)

一種WLCSP元器件先進運輸包裝材料解決方案 楊 青 六(43)

基于物聯(lián)網(wǎng)技術(shù)的地表水質(zhì)監(jiān)測預(yù)警系統(tǒng)設(shè)計 張 靜，皇甫瑋喆 十二(44)

Electronics&Packaging

Vol.16,No.1～12 Contents Index(2016)

Author No.Page

Packaging&Assembly&Testing

Analysis of Hook Position in Double Bond Pulling Test LING Yong,LV Yin 1(1)

Delamination and Its Countermeasures in IC Plastic Package ZHOU Chaofeng,ZHOU Jincheng,LI Xizhou 1(5)

Researching of Multi-site Efficient Test for DFT IC SUN Kaifan 1(9)

The Research of Programmable Logic Device Testing Method Based on the ATE XIE Weikun 1(12)

BGA Soldering Quality Detection Techniques by X Ray Imaging HE Zhigang,LIANG Kun,ZHOU Qingbo,GONG Guohu,WANG Xiaomin 2(1)

Application of Wire Bonding of Multi-Stack Die in the Ceramic Package LIAO Xiaoping,GAO Liang 2(5)

Finite Element Analysis of Failure Mode of TO Ceramic Package SI Jianwen,GUO Huaixin,WANG Ziliang 2(9)

Assembly Technology Research of Magnetic Sensor in SSIP4L Package CHEN Guolan,NIU Sheqiang,HE Wenhai 2(14)

Packaging Process of SiC Hybrid Power Module Xu Wenhui,CHEN Yun,WANG Li 3(1)

Study on IMC Formation of Different Sn-Pb Bumps with Multiple Reflow Times WEN Huidong,LIN Pengrong,LIAN Binhao,WANG Yong,YAO Quanbin 3(4)

Hermetic Soldering Technics on Kovar and AI/SiCp Composite Material JIN Jiafu,YANG Cheng,HAO Shaoxin 3(9)

The Research of MCM Packaging Technology HU Yanni 3(12)

The Research of Testing Technology for Flash Memory of NOR Type WANG Zhengyu,ZHAO Hua 3(15)

Performance Study of a Novel Silver-filled Conductive Adhesive Used for Die Bonding ZOU Jiajia,GAO Hong,ZHOU Jinwen 4(1)

Failure Analysis of Solder Joint in SiP Modules PAN Shushan,CHEN Ying,JI Bin 4(4)

Test Method of Analog Signals Based on TR6800 Controls OSC DU Yuanxun 4(9)

The Research of Aerospace Components Measurement Applied in Space Orbit CHEN Jiapeng,CAI Jieming,HUANG Xudong,SONG Guodong 4(13)

Research on Producing Pattern Files Based on the V93000 ATE MTL ZHAO Hua,WANG Zhengyu,LI kai 4(18)

The Challenges Confronting the Development of Advanced RF Packaging Technology XIA Yunan,CHEN Yuning,XU Liqing,DAI Zhou,LI Huaxin,CHENG Kai 5(1)

Error Compensation Based on RBF in Bonder HONG Xi,LI Wei,LU Jia,BAI Hong,SUN Haibo 5(7)

Research on Process of Cavity in LTCC Substrate LI Shanze,LIU Hongyu,DU Bin,FENG Xiaoxi,MA Qiqi 5(10)

The Development of a Hybrid-technique-manufactured Microwave Sealed Cavity WANG Chen,CHEN Kan,ZHENG Dongxia 5(14)

Evaluation Research of Chip Assembly Technology Based on Statistical Methods of Literature LV Xubo,HUANG Jiaoying,GAO Cheng,WANG Xiangfen 5(18)

The Effect of Epoxy on the Reliability of Plastic Integrated Circuit LI Qiang,LI Hong 5(23)

Research Status of Sn-Cu-Ni Solders CHEN Zhe,LI Yang 6(1)

Semiconductor Devices TO Vacuum Packaging Based on Discharge Welding LI Xiaogang,XU Jian 6(10)

Reliability Design and Analysis of Gold Wire in SiP Sensor Module LIU Jianjun,GUO Yuhua 6(14)

Effect of Nano Inorganic Particles on Epoxy Resin Adhesive Breakdown Voltage MO Hongqiang,QIN Huibin,MAO Xianggen 6(17)

Test and Analysis of Gate Charge in MOSFET ZHANG Wentao,HAO Yuelan 6(21)

Test Method for UltraFlex-based Multiple Clock Domain Circuit YAN Huaxin 6(24)

Studies on Analysis Method of Junction-to-Case Thermal Resistance of Ceramic Multi-chip Packaging GAO Hui,TONG Liangyu,JIANG Changshun 7(1)

Evaluation and Control Method of Cavity Deformation in LTCC Green Tape Lamination Process WANG Yunlong,LIU Jianjun,LIU Longhua,QIU Yingxia,WANG Zhiqin 7(5)

Imapact of Nanoparticles on Thermal Properties of Epoxy Adhesive MO Hongqiang,QIN Huibin,MAO Xianggen 7(10)

Microwave Performance Improvement of Metal Packages for Optoelectronic Devices YUAN Zhongchao,XU Jian,CUI Dajian,YAO Keming 7(14)

Research of Packaging-used Silumin Alloys in Hermetic Laser Welding XU Xiao,LIU Yan,CHEN Jiemin,CHENG Kai 8(1)

Research of the Proficiency Testing for Destructive Test YANG Cheng,TAN Chen,WANG Bochun 8(5)

Research on Contact Critical Dimension Measurement and Process Capability ImprovementLI Xinghe 8(9)

CFD Numerical Simulation of Electronic Equipment Cooling in the Perspective of Field Synergy Principle MA Fangfang,YUN Heming,LI Yongzhen 9(1)

SiP-based Integrated Electronic System of Spacecraft HUANG Hu,LI Hua,KONG Yong,FAN Guochen,ZHANG Yaolei 9(6)

A Test Method of Lithium Battery Charging IC ZHANG Penghui 9(10)

Overview of Development of Interconnected PCB ZOU Jiajia,ZHAO Dan,CHENG Mingsheng 10(1)

Status-Quo and Challenges of CCGA Solder Columns LI Shouwei,MAO Chongchong,YAN Dandan 10(6)

Optimization of Stainless Screen Cleaning During LTCC Process LU Huixiang,CHEN Lei,TANG Xiaoping,YAN Yingzhan 10(11)

Evaluation of IC Test Equipment after Replacement HE Yanqing 10(15)

Studies of Quasi-hermetic Air Cavity Packaging GAO Hui,XIAO Hanwu,LI Zongya 11(1)

An Automatic Test Method for LNA ZHANG Kaihong,SU Yang,WU Qianwen 11(7)

Studies of MOS Turn-on Resistance Measurement Methods HAN Xinfeng,GU Weimin 11(10)

A Design and Implementation Scheme of Multi-Site Test for ATE-based Power Chip TANG Caibin 11(14)

Research of Statistic Process Control in Gold Wire-bonding FAN Shaoqun,ZHAO Dan 12(1)

Studies of Effect of Adhesion Promoter on Epoxy Molding Compound QIN Wangyang,ZHANG Gaowen,DING Quanqing 12(6)

Research of InSn48 Vacuum Soldering for Optoelectronic Window WANG Binbin,JIANG Defeng 12(12)

Research of a Test Technology for Optical Signal Processing Chip ZHANG Penghui 12(16)

Application of Vision Inspection System for Symmetrical Device Misplacement on Packing Tape TANG Mingching,ZHANG Jun 12(20)

An Iteration-based Fuse Trimming Test Method WU Xiwen,GU Weimin 12(23)

IC Design

The Functional Verification and Simulation of McBSP Communication Based on SPI Protocol SUN Jing,TAO Jianzhong,CHEN Zhenjiao 1(16)

Synchronous Rectification DC/DC BOOST Soft Start Circuit LI Liang,LAI Pengfei,CAO Fabing,CHEN Feng 1(21)

Research of Synchronization for Signals Cross Clock Domains in SoC Design WANG Jian,ZHANG Lei,WANG Zhen,ZHAO Zhonghui,CHEN Yaning 1(25)

A Design of Circuit of RDC on the Basic of the TypeⅡTracking Loop Algorithm LIU Taiguang,BAO Shenghui,MIAO Yun,QIANG Xiaoyan 1(31)

Microsystems Analysis and Design YANG Fang,WANG Liangjiang 2(19)

Design of a Baseline Wander Canceller for Ethernet Transceiver ZHANG Shuai,XU Shengquan,YU Jianwang,LI Zhenghao,QIU Yibo,ZHENG Yan 2(23)

The Restrain of Ringing Phenomenon for Buck DC-DC Circuit LAI Pengfei,CHEN Feng,CAO Fabing,Li Liang 2(28)

The Design of Ku-band T/R Module YAO Ruoyan,WEI Bin 2(33)

FPGA Configuration SRAM Design Technology ZHANG Yanfei,GENG Yang 3(20)

Design of an ARINC 429 Line Receiver Based on General CMOS Technology LI Ke,GU Fei 3(23)

Design of Radiation Hardened SRAM Based on DICE SHEN Jing,XUE Haiwei 3(26)

The Design and Implementation of a Multichannel Buffered Serial Port YANG Xiaogang,QIANG Xiaoyan,LIU Taiguang 3(31)

The Research of Frequency Jitter Using in Monolithic Switching Power IC SUN Dacheng 3(37)

A Design of MBIST Based on Scan Chain Block RAM CONG Hongyan,YAN Hua,HU Kai,ZHANG Yanfei 4(21)

Design of a High PSRR Bandgap Reference without Using an Opamp LIU Li 4(24)

A Kind of Circuit Design of Wireless Charging Management System YANG Peikai,SHI Xiong 4(29)

Mono-pulse Radar Receiver Based on Gain and Phase Detect ZHI Min,ZHANG Hui 4(34)

Design of a Fully Differential High Gain and Low-power and High Bandwidth Amplifier ZHOU Ji,GONG Min,GAO Bo 5(26)

Clock Architecture Analysis of FPGA Chip ZHANG Yanfei,XIE Changsheng,KUANG Chenguang 6(28)

Design of an Embedded NOR Flash Controller IP XIE Tongtong,LI Tianyang 7(18)

High-Speed SRAM Compiler Timing Algorithm HUANG Ben,PENG Li,WU Haihong 7(22)

Design of a High-Speed LVDS Receiver HU Qingcheng,HE Lingwei,ZHOU Xiaobin 7(26)

Design of a Sense Amplifier for OTP Memory YUAN Tongwei,PAN Bin,SUN Jiejie,HU Xiaoqin 7(29)

Parallel FIR Filter Based on Reconfigurable Processor GU Zhiwei,LI Li,FU Chuanzhang,FU Yuxiang,LI Wei 8(14)

Design of Radiation Hardened D Flip-Flop Based on DICE SUN Jing,CHEN Zhenjiao,TAO Jianzhong,ZHANG Yuhan 8(19)

Design of a DSP-based Universal Memory Interface XIE Tongtong,LI Tianyang 8(24)

Design of 14-bit 1 GS/s Current Steering D/A Converter for DDS Application YANG Junhao,ZHANG Ganying,ZHANG Tao 8(30)

Design of a Bandgap Reference with Curvature Compensation LV Jiangping,HU Qiaoyun 8(34)

ESD Protection Design for CMOS High Speed I/O SUN Yunhua，ZOU Jiaxuan 9(14)

A High Order Temperature Compensation Bandgap Voltage Reference Based on the Feedback Controlling WANG Yuxing,WU Jin 9(18)

A Design Method of PCI-bus-based Digital Pattern Generator LU Jun,ZHANG Guoliang,CAO Jing,CHEN Lun 9(24)

Investigation and Design of Millimeter-wave T/R Sub-array ZHANG Wei，ZHANG Junhua 9(28)

Layout Design of SKILL-based Parameterized Radiation-hardened Device HU Yongqiang,ZHOU Yuan 9(31)

Design of Gearbox Circuits for FPGA System LUO Yang,HE Guangxu,LEI Shulan 10(19)

A Technology of Remote Flash Programming to TMS320F2812 with Watchdog-feeding Function JIANG Jiongwei,LEI Zhijun,YU Peng 10(23)

A Design of Low-Voltage and Low-Power Consumption Multivibrator YING Tao,CHEN Dingping,LI Jingshan 10(27)

Packing Implementation and Verification for 10M-gate FPGA HU Kai,DONG Zhidan,HUI Feng,LI Qing,DONG Yiping 10(32)

A Design of Bandgap Voltage Reference Circuit with Offset Voltage Elimination Function XU Shengquan,ZHANG Shuai 11(18)

Studies of FPGA Switch Matrix HU Kai,XIE Da,LIU Tong,ZHANG Yanfei,SHAN Yueer 11(23)

A Design of RF Front-end TR Module for Altimeter Measuring System CAI Mao,PAN Bei,YU Jian,MA Jianjun,WEN Yanbing 11(27)

A Design of Electrostatic/Surge Voltage Discharge Structure for Control Port of Microwave Control Circuit PAN Jiebin,CHEN Jixue,JIANG Nan 11(31)

Studies of Resonance Process for Shifted-Phase Full-Bridge Zero-Voltage PWM Soft-Switching Circuit WANG Jingang,LIU Peng 11(35)

Design and Application of Wideband Directional Coupler WANG Jiabo,CAO Xuesong 11(39)

A Design of ECAN Embedded in DSP2F0X and Communication System BAO Yipeng,QIANG Xiaoyan 12(26)

A Design of TCXO Chip with High Accuracy and Wide Compensation Temperature Range CHEN Futao 12(30)

Research on Simulation Method of Large Capacity Synchronous Dual-port SRAM ZHOU Yunbo,LI Xiaorong 12(35)

Device Fabrication&Reliability

A Buried-layer Epitaxy Technology by Varying Temperature and Doping Flow ZHAO Jianjun,XIAO Jiannong,MA Linbao 1(34)

Simulation Analysis of Laser Trimming Using L-Cut LIU Jianjun,WANG Yunlong 2(37)

Failure Analysis of HTCC Integral Substrate/Package QIU Yingxia,HU Jun,LIU Jianjun 3(41)

Study of Commercial 0.18 μm CMOS Total Ionizing Dose Effects KOU Chunmei,XIE Rubin,HONG Genshen,WU Jianwei 4(40)

The Optimization Study on Process Flow of Sputter Equipment Chamber WANG Haidong 4(45)

A New Method to Fabricate NiO Thin Films and Its Application YE Ke,QIAO Ming 5(31)

8-Way Wideband Oversized Coaxial Power Divider ZHANG Yongjia,QIAN Xingcheng,ZHU Qinglin 5(35)

Fabrication Technology for LTCC Curved SubstrateLU Huixiang,YAN Yingzhan,TANG Xiaoping,MING Xuefei 5(39)

Processing Study on LCP RF MEMS Switch DANG Yuanlan,ZHAO Fei,HAN Lei,XU Yaxin,LIANG Guanghua, LIU Xiaolan,CHEN Yu,ZHUANG Zhixue 5(43)

Studies on Testing Plasma Damages in WAT in CMOS Technology CHEN Peicang,XU Zheng,LI Jun 6(31)

A New Evaluation Test for Long Storage Life of CMOS Component LIU Shiquan,XU Chao,QIN Chenfei,WANG Jianjun 6(36)

Electronic Components Quality Control During Secondary Screening Process WANG Xiaoping 6(39)

Design of L-band Power Switch MENG Xiangjun,YANG Lei,HUANG Zhensong,SONG Yan,XU Qing 7(34)

Studies of 0.18μm Fully Isolated Low Ron NLDMOS FENG Zheyun,MA Qiancheng,WANG Ming 7(39)

NAND Flash Floating Gate Dry Etch Technology Optimization to Tackle Program Failure CHEN Liang,ZHOU Chaofeng,LI Xiaobo 7(44)

Research of Relationship Between Well Doping Concentration and Breakdown Voltage in Thin-Epitaxy CMOS Chips HAN Zhaofang,XIE Da,QIAO Yanmin 8(37)

Endurance Analysis of Ge2Sb2Te5-based Phase Change Memory LI Ying,ZHAN Yipeng,WANG Lei 8(41)

The Performance Test and Reliability Evaluation of 150 nm GaAs PHEMT Based on the 248 nm Stepper GUO Xiao,ZHANG Junyun,LIN Gang 8(44)

Study of Halo Technology in Improving Device Performance XU Zheng,LI Hongzheng,ZHAO Wenbin 9(35)

Study of Radiation Hardening Technology of Bulk CMOS Integrated Circuits MI Dan,ZUO Lingling 9(40)

Feasibility Study on Wafer Dicing by Silicon Deep Reactive Ion Etching LIU Xueqin，DONG Anping 9(44)

Optimization of Contact Layer Illumination Type to Improve Lithography Manufacture LIU Juan 10(36)

Studies of Transient Temperature Response of Power Amplifier ICs in T/R Module SHENG Zhong,ZHOU Jun,DING Xiaoming,SHEN Ya 10(39)

Research of Full-power Aging Technology for Microwave Transistor WANG Xiaoping,LI Xue,ZHANG Limin,QIN Hao 10(43)

An Optimization Method of 1200 V IGBT LI Hong 11(44)

Studies of Quality Control During Secondary Screening WANG Yu 12(40)

Products&Application&Market

Repair and Application of IC Handler ZHOU Chun,JIANG Wenguang 1(38)

Software Design of Embedded Image-processing System Based on TMS320DM8168 WANG Xiaolong,SHAO Chunwei,ZHU Chen 1(44)

A Kind of Highly Reliable Serial Communication Protocol GUI Jianghua,SHAO Jian,PAN Miao 2(40)

Research on Automatic Test System of High Voltage ACParameters Based on Microcomputer CHEN Yang,XIE Lili 2(44)

A New Type Thermal Method for Oxygen Concentration Measurement QIAN Jiangrong,CHEN Cong,XU Lei,HU Guojun 3(45)

Advanced Transport Package Material Solution for WLCSP Component YANG Qing 6(43)

Design and Application of System of Surface Water Quality Monitoring and Warning based on Internet of Things ZHANG Jing,HUANGFU Weizhe 12(44)